International Stand Out Scholarship at Bond University 2026
Apply to International Stand Out Scholarship at Bond University 2026 which can be taken at and provides 25% tuition remission
Deadline: 20 Aug, 2026bachelorsmasters
Updated 23 Jul 2026
Overview
Details about International Stand Out Scholarship at Bond University 2026 International Stand Out Scholarship at Bond University 2026 is offered for Bachelors , Masters degree in the field of Selected subjects offered by the University . You can apply to this scholarship here . The deadline for the sending your application is 20 Aug, 2026 . This scholarship is provided by Bond University and the value of this scholarship is Partial Funding, 25% tuition remission . This scholarship is open for: Open to selected countries. Degree: Bachelors , Masters Provided by: Bond University Provider: Bond University. Details are indicative and may change — verify on the official scholarship site before applying.
Eligibility
Eligibility Criteria of the International Stand Out Scholarship: Applicants must be from the selected list of nationalities. Applicants (Undergraduate) must fulfill the following criteria: Achieve academic excellence in the top percentile from the high school qualification equivalent to ATAR 90.00 or IB Diploma score of 32 or higher. Not have completed Australian Y12 onshore in Australia. Applicants (Postgraduate) must fulfill the following criteria: Achieve predetermined academic merit in the undergraduate studies. Surpass the standard entry requirements of the chosen program of study. May have previously completed a Bond academic or English program. Applicants must commence the studies in either the January, May or September semester. Application Process: All eligible candidates are automatically considered for the scholarship at the time of admission. Value of the Scholarship : The successful candidates will receive a 25% tuition remission for any single or approved combined undergraduate or postgraduate degree. Source : Bond University Disclaimer: All Content, Logo and Company names are registered trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Report inaccuracy in this page Related Links of Bond University Explore Bond University scholarships for International students Apply to an Education Loan to Study at Bond University FAQs <ol class="faq
Benefits
Partial Funding , 25% tuition remission
FAQs
Who can apply for International Stand Out Scholarship at Bond University 2026?
Eligibility Criteria of the International Stand Out Scholarship: Applicants must be from the selected list of nationalities. Applicants (Undergraduate) must fulfill the following criteria: Achieve academic excellence in the top percentile from the high school qualification equivalent to ATAR 90.00 or IB Diploma score of 32 or higher. Not have completed Australian Y12 onshore in Australia. Applicants (Postgraduate) must fulfill the following criteria: Achieve predetermined academic merit in the undergraduate studies. Surpass the standard entry requirements of the chosen program of study. May have previously completed a Bond academic or English program. Applicants must commence the studies in either the January, May or September semester. Application Process: All eligible candidates are automatically considered for the scholarship at the time of admission. Value of the Scholarship : The successful candidates will receive a 25% tuition remission for any single or approved combined undergraduate or postgraduate degree. Source : Bond University Disclaimer: All Content, Logo and Company names are registered trademarks of their respective holders. Use of them does not imply any affiliation with or endorsement by them. Report inaccuracy in this page Related Links of Bond University Explore Bond University scholarships for International students Apply to an Education Loan to Study at Bond University FAQs <ol class="faq
Is this listing final?
Deadlines and award values change. Always verify on the official scholarship provider website before applying.
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